Conn Backplane HDR 90 POS 2mm Press Fit RA Thru-Hole, 10124451-101LF, Amphenol

Next-generation AirMax VSe connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backwards mating-compatible interfaces to existing AirMax VS connectors with minimal changes to connector footprints.The connectors combine FCI technologies for a shieldless design with no metallic plates and closely edge-coupled differential pairs with innovative design improvements to yield low loss and low crosstalk.Right angle receptacles and right angle headers will support backplane, midplane or coplanar applications. The mating-compatible interfaces and capability to preserve critical pin assignments can provide opportunities for cost savings as new or upgraded equipment is deployed. For example, a backplane or chassis can be designed to allow the installation and continued use of legacy daughter cards, line cards or blades that are already in the field as well as new or future higher-speed module cards.

  • Provides a migration path for up to 25Gb/s per differential pair
  • Shieldless design with closely coupled pairs
  • Backward mateable to existing AirMax VS® and AirMax VS2® designs
  • 3 pair backplane and coplanar versions are available
  • Hard metric design practice

Характеристики

Бренд

Max_voltage_rating

50 Vac

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_airmax_vse.pdf

Number_of_rows

9

Base_housing_material

Thermoplastic

Product_dimensions

21.9 x 29.5 x 16.4

Number_of_contacts

90 POS

Max_contact_resistance

60 MOhm

Schedule_b

8536694040

Kind

Backplane

Product_length

21.9 mm

Country_of_origin

China

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin Over Nickel

Max_current_rating

0.5/Contact A

Mounting

Through Hole

Pin_count

90

Артикул: 10124451-101LF

Описание

Next-generation AirMax VSe connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backwards mating-compatible interfaces to existing AirMax VS connectors with minimal changes to connector footprints.The connectors combine FCI technologies for a shieldless design with no metallic plates and closely edge-coupled differential pairs with innovative design improvements to yield low loss and low crosstalk.Right angle receptacles and right angle headers will support backplane, midplane or coplanar applications. The mating-compatible interfaces and capability to preserve critical pin assignments can provide opportunities for cost savings as new or upgraded equipment is deployed. For example, a backplane or chassis can be designed to allow the installation and continued use of legacy daughter cards, line cards or blades that are already in the field as well as new or future higher-speed module cards.

  • Provides a migration path for up to 25Gb/s per differential pair
  • Shieldless design with closely coupled pairs
  • Backward mateable to existing AirMax VS® and AirMax VS2® designs
  • 3 pair backplane and coplanar versions are available
  • Hard metric design practice

Детали

Бренд

Max_voltage_rating

50 Vac

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_airmax_vse.pdf

Number_of_rows

9

Base_housing_material

Thermoplastic

Product_dimensions

21.9 x 29.5 x 16.4

Number_of_contacts

90 POS

Max_contact_resistance

60 MOhm

Schedule_b

8536694040

Kind

Backplane

Product_length

21.9 mm

Country_of_origin

China

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin Over Nickel

Max_current_rating

0.5/Contact A

Mounting

Through Hole

Pin_count

90