Conn AirMax VS HDR 72 POS 2mm Press Fit ST Thru-Hole, 10114761-101LF, Amphenol

AirMax VShigh speed signal connectors from FCI meet the dimensional and electrical requirements described in the CompactPCI Serial (PICMG CPCI-S.0) Specification. Connections between a front system or peripheral board and backplane are accomplished using right-angle headers and vertical receptacles. The interface to a rear I/O board uses right-angle receptacles and vertical headers. The open pin field design of AirMax VS signal connectors provides flexibility to use pins for differential or single-ended signals, ground or power The CompactPCI Serial Specification moves Compact PCI architecture to high-speed serial interconnects to add greater support for serial point to point fabrics like PCI Express Ethernet and USB in the classic CompactPCI form factor with mechanics fully compliant to IEC 1101. The specification contains definitions for both system and peripheral slots in 3U and 6U board sizes The specification allows hybrid systems integrating legacy CompactPCI boards and newer CompactPCI Serial boards to simplify the migration to to serial interconnect technologies.

  • Meet the mechanical and electrical requirements of the CompactPCI Serial Specification
  • FCI technologies for shield-less design with no metallic plates and closely coupled differential pairs deliver low loss and crosstalk
  • Support PCI Express, SATA/SAS, USB 2.0/3.0 and 10 Gigabit Ethernet high-speed serial interfaces
  • Signal density of up to 184 pin pairs (on 3U) with serial data rates up to 12.5 Gb/s.
  • Opposed dual-beam receptacle contact structure provides high reliability
  • Open pin field design provides flexibility to use pins for differential or single-ended signals, ground or power
  • Compatible with Hard Metric equipment design practice
  • Halogen free products aid efforts to minimize the use of environmentally sensitive materials in the electronics industry
  • Lead-Free and RoHS compliant

Характеристики

Бренд

Contact_material

Copper Alloy

Schedule_b

8536695050

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_airmax_midplane.pdf

Termination_method

Press Fit

Contact_plating

Gold Over Nickel

Gender

HDR

Body_orientation

Straight

Number_of_rows

12

Housing_color

Black

Base_housing_material

Thermoplastic

Product_dimensions

11.9 x 20.15 x 12.45

Number_of_contacts

72 POS

Product_length

11.9 mm

Kind

AirMax VS

Country_of_origin

China

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin Over Nickel

Pitch

2.0000 mm

Max_processing_temp

260

Mounting

Through Hole

Operating_temperature

-55 to 85 °C

Pin_count

72

Артикул: 10114761-101LF

Описание

AirMax VShigh speed signal connectors from FCI meet the dimensional and electrical requirements described in the CompactPCI Serial (PICMG CPCI-S.0) Specification. Connections between a front system or peripheral board and backplane are accomplished using right-angle headers and vertical receptacles. The interface to a rear I/O board uses right-angle receptacles and vertical headers. The open pin field design of AirMax VS signal connectors provides flexibility to use pins for differential or single-ended signals, ground or power The CompactPCI Serial Specification moves Compact PCI architecture to high-speed serial interconnects to add greater support for serial point to point fabrics like PCI Express Ethernet and USB in the classic CompactPCI form factor with mechanics fully compliant to IEC 1101. The specification contains definitions for both system and peripheral slots in 3U and 6U board sizes The specification allows hybrid systems integrating legacy CompactPCI boards and newer CompactPCI Serial boards to simplify the migration to to serial interconnect technologies.

  • Meet the mechanical and electrical requirements of the CompactPCI Serial Specification
  • FCI technologies for shield-less design with no metallic plates and closely coupled differential pairs deliver low loss and crosstalk
  • Support PCI Express, SATA/SAS, USB 2.0/3.0 and 10 Gigabit Ethernet high-speed serial interfaces
  • Signal density of up to 184 pin pairs (on 3U) with serial data rates up to 12.5 Gb/s.
  • Opposed dual-beam receptacle contact structure provides high reliability
  • Open pin field design provides flexibility to use pins for differential or single-ended signals, ground or power
  • Compatible with Hard Metric equipment design practice
  • Halogen free products aid efforts to minimize the use of environmentally sensitive materials in the electronics industry
  • Lead-Free and RoHS compliant

Детали

Бренд

Contact_material

Copper Alloy

Schedule_b

8536695050

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_airmax_midplane.pdf

Termination_method

Press Fit

Contact_plating

Gold Over Nickel

Gender

HDR

Body_orientation

Straight

Number_of_rows

12

Housing_color

Black

Base_housing_material

Thermoplastic

Product_dimensions

11.9 x 20.15 x 12.45

Number_of_contacts

72 POS

Product_length

11.9 mm

Kind

AirMax VS

Country_of_origin

China

Eccn

EAR99

Htsn

8536694040

Lead_finish

Tin Over Nickel

Pitch

2.0000 mm

Max_processing_temp

260

Mounting

Through Hole

Operating_temperature

-55 to 85 °C

Pin_count

72