Conn High Density HDR 216 POS 1.8mm Press Fit ST Thru-Hole, 10080638-101LF, Amphenol

The ZipLine connector system addresses customer demand for maximum signal density – a paramount requirement for future equipment platforms – at data rates up to 12.5Gb/s.The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs provides the maximum density available by delivering 84.6 differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. ZipLine connectors can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density.

  • Modules with 6 differential pairs/column provide maximum linear signal density along card edge: 84.6 differential pairs per inch
  • An optional power wafer with up to 36A capacity can be integrated within a 6-pair module
  • Stainless steel organizer allows use of flat-rock tooling for connector installation
  • Halogen-free signal modules aid efforts to minimize the use of environmentally sensitive materials
  • Available power and guide modules complement signal connector offering

Характеристики

Бренд

Contact_material

Copper Alloy

Schedule_b

8536694030

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_zipline_vs_backplanemidplane.pdf

Termination_method

Press Fit

Gender

HDR

Body_orientation

Straight

Number_of_rows

12

Housing_color

Black

Base_housing_material

Thermoplastic

Product_dimensions

26.8 x 23.2 x 12.45 mm

Number_of_contacts

216 POS

Product_length

26.8 mm

Kind

High Density

Country_of_origin

Malaysia

Eccn

EAR99

Htsn

8536694030

Lead_finish

Tin

Pitch

1.8000 mm

Max_processing_temp

260

Mounting

Through Hole

SKU: 10080638-101LF

Description

The ZipLine connector system addresses customer demand for maximum signal density – a paramount requirement for future equipment platforms – at data rates up to 12.5Gb/s.The initial ZipLine signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs provides the maximum density available by delivering 84.6 differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. ZipLine connectors can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density.

  • Modules with 6 differential pairs/column provide maximum linear signal density along card edge: 84.6 differential pairs per inch
  • An optional power wafer with up to 36A capacity can be integrated within a 6-pair module
  • Stainless steel organizer allows use of flat-rock tooling for connector installation
  • Halogen-free signal modules aid efforts to minimize the use of environmentally sensitive materials
  • Available power and guide modules complement signal connector offering

Additional information

Бренд

Contact_material

Copper Alloy

Schedule_b

8536694030

Specifications

http://www.amphenol-icc.com/media/wysiwyg/files/documentation/datasheet/backplane/bpl_zipline_vs_backplanemidplane.pdf

Termination_method

Press Fit

Gender

HDR

Body_orientation

Straight

Number_of_rows

12

Housing_color

Black

Base_housing_material

Thermoplastic

Product_dimensions

26.8 x 23.2 x 12.45 mm

Number_of_contacts

216 POS

Product_length

26.8 mm

Kind

High Density

Country_of_origin

Malaysia

Eccn

EAR99

Htsn

8536694030

Lead_finish

Tin

Pitch

1.8000 mm

Max_processing_temp

260

Mounting

Through Hole