MCU 16-bit/32-bit LPC3000 ARM926EJ-S RISC ROMLess 1.2V/1.8V/2.8V/3.3V/5V 180-Pin TFBGA Tray, LPC3131FET180,551, NXP

The NXP LPC3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go (OTG), up to 192 KB SRAM, NAND flash controller, flexible external bus interface, four channel 10-bit ADC, and a myriad of serial and parallel interfaces in a single chip targeted at consumer, industrial, medical, and communication markets. To optimize system power consumption, the LPC3130/3131 have multiple power domains and a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and scaling.

  • CPU platform
    • 180 MHz, 32-bit ARM926EJ-S
    • 16 kB D-cache and 16 kB I-cache
    • Memory Management Unit (MMU)
  • Internal memory
    • 96 kB (LPC3130) or 192 kB (LPC3131) embedded SRAM
  • External memory interface
    • NAND flash controller with 8-bit ECC
    • 8/16-bit Multi-Port Memory Controller (MPMC): SDRAM and SRAM
  • Communication and connectivity
    • High-speed USB 2.0 (OTG, Host, Device) with on-chip PHY
    • Two I2S-bus interfaces
    • Integrated master/slave SPI
    • Two master/slave I2C-bus interfaces
    • Fast UART
    • Memory Card Interface (MCI): MMC/SD/SDIO/CE-ATA
    • Four-channel 10-bit ADC
    • Integrated 4/8/16-bit 6800/8080 compatible LCD interface
  • System functions
    • Dynamic clock gating and scaling
    • Multiple power domains
    • Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
    • DMA controller
  • Operating voltage and temperature
    • Core voltage: 1.2 V
    • I/O voltage: 1.8 V, 3.3 V
    • Temperature: -40 °C to +85 °C
  • TFBGA180 package: 12 x 12 mm2, 0.8 mm pitch

Характеристики

Product_dimensions

12 x 12 x 0.8 mm

Screening_level

Industrial

Schedule_b

8542310000

Ram_size

192 Kb

Program_memory_type

ROMLess

Pin_count

180

Supplier_package

TFBGA

Operating_temperature

-40 to 85 °C

Operating_supply_voltage

1.2, 1.8, 2.8, 3.3, 5 V

Specifications

https://4donline.ihs.com/images/VipMasterIC/IC/PHGL/PHGLS25043/PHGLS25043-1.pdf?hkey=52A5661711E402568146F3353EA87419

On_chip_adc

4-chx10-bit

Number_of_timers

4

Htsn

8542310001

Eccn

EAR99

Device_core

ARM926EJ-S

Data_bus_width

16, 32 Bit

Country_of_origin

Taiwan

Бренд

Instruction_set_architecture

RISC

Тип интерфейса

I2C/I2S/UART/USB

Max_speed

180 MHz

Msl_level

3

Mounting

Surface Mount

Min_operating_supply_voltage

1, 1.1, 1.65, 2.7 V

Max_processing_temp

260 °C

Max_operating_supply_voltage

1.3, 3.6 V

Lead_finish

Tin/Silver/Copper

Артикул: LPC3131FET180,551

Описание

The NXP LPC3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go (OTG), up to 192 KB SRAM, NAND flash controller, flexible external bus interface, four channel 10-bit ADC, and a myriad of serial and parallel interfaces in a single chip targeted at consumer, industrial, medical, and communication markets. To optimize system power consumption, the LPC3130/3131 have multiple power domains and a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and scaling.

  • CPU platform
    • 180 MHz, 32-bit ARM926EJ-S
    • 16 kB D-cache and 16 kB I-cache
    • Memory Management Unit (MMU)
  • Internal memory
    • 96 kB (LPC3130) or 192 kB (LPC3131) embedded SRAM
  • External memory interface
    • NAND flash controller with 8-bit ECC
    • 8/16-bit Multi-Port Memory Controller (MPMC): SDRAM and SRAM
  • Communication and connectivity
    • High-speed USB 2.0 (OTG, Host, Device) with on-chip PHY
    • Two I2S-bus interfaces
    • Integrated master/slave SPI
    • Two master/slave I2C-bus interfaces
    • Fast UART
    • Memory Card Interface (MCI): MMC/SD/SDIO/CE-ATA
    • Four-channel 10-bit ADC
    • Integrated 4/8/16-bit 6800/8080 compatible LCD interface
  • System functions
    • Dynamic clock gating and scaling
    • Multiple power domains
    • Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
    • DMA controller
  • Operating voltage and temperature
    • Core voltage: 1.2 V
    • I/O voltage: 1.8 V, 3.3 V
    • Temperature: -40 °C to +85 °C
  • TFBGA180 package: 12 x 12 mm2, 0.8 mm pitch

Детали

Product_dimensions

12 x 12 x 0.8 mm

Screening_level

Industrial

Schedule_b

8542310000

Ram_size

192 Kb

Program_memory_type

ROMLess

Pin_count

180

Supplier_package

TFBGA

Operating_temperature

-40 to 85 °C

Operating_supply_voltage

1.2, 1.8, 2.8, 3.3, 5 V

Specifications

https://4donline.ihs.com/images/VipMasterIC/IC/PHGL/PHGLS25043/PHGLS25043-1.pdf?hkey=52A5661711E402568146F3353EA87419

On_chip_adc

4-chx10-bit

Number_of_timers

4

Htsn

8542310001

Eccn

EAR99

Device_core

ARM926EJ-S

Data_bus_width

16, 32 Bit

Country_of_origin

Taiwan

Бренд

Instruction_set_architecture

RISC

Тип интерфейса

I2C/I2S/UART/USB

Max_speed

180 MHz

Msl_level

3

Mounting

Surface Mount

Min_operating_supply_voltage

1, 1.1, 1.65, 2.7 V

Max_processing_temp

260 °C

Max_operating_supply_voltage

1.3, 3.6 V

Lead_finish

Tin/Silver/Copper