The STM32F411xC/xE devices are based on the high-performance ARM Cortex -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Its Cortex -M4 core features a Floating point unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.The STM32F411xC/xE belongs to the STM32 Dynamic Efficiency product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching.The STM32F411xC/xE incorporate high-speed embedded memories (up to 512 Kbytes of Flash memory, 128 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB bus and a 32-bit multi-AHB bus matrix.All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.
Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
Core: ARM® 32-bit Cortex® -M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
Memories
up to 512 Kbytes of Flash memory
128 Kbytes of SRAM
Clock, reset and supply management
1.7 V to 3.6 V application supply and I/Os
POR, PDR, PVD and BOR
4-to-26 MHz crystal oscillator
Internal 16 MHz factory-trimmed RC
32 kHz oscillator for RTC with calibration
Internal 32 kHz RC with calibration
Power consumption
Run: 100 µA/MHz (peripheral off)
Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ @ 25C; 65 µA max @25 °C
Stop (Flash in Deep power down mode, fast wakeup time): down to 10 µA @ 25 °C; 30 µA max @25 °C
Standby: 2.4 µA @25 °C / 1.7 V without RTC; 12 µA @85 °C @1.7 V
VBATsupply for RTC: 1 µA @25 °C
1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer
Debug mode
Serial wire debug (SWD) & JTAG interfaces
Cortex® -M4 Embedded Trace Macrocell™
Up to 81 I/O ports with interrupt capability
Up to 78 fast I/Os up to 100 MHz
Up to 77 5 V-tolerant I/Os
Up to 13 communication interfaces
Up to 3 x I²C interfaces (SMBus/PMBus)
Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol, SPI2 and SPI3 with muxed full-duplex I²S to achieve audio class accuracy via internal audio PLL or external clock
SDIO interface (SD/MMC/eMMC)
Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY
CRC calculation unit
96-bit unique ID
RTC: subsecond accuracy, hardware calendar
All packages (WLCSP49, LQFP64/100, UFQFPN48, UFBGA100) are ECOPACK® 2
