Описание
MCU 32-Bit LPC11U24 ARM Cortex-M0 RISC 32KB Flash 1.8V to 3.6V 32-Pin HVQFN Tray
MCU 32-Bit LPC11U24 ARM Cortex-M0 RISC 32KB Flash 1.8V to 3.6V 32-Pin HVQFN Tray
Product_dimensions | 5 x 5 x 0.85 mm |
---|---|
Screening_level | Industrial |
Schedule_b | 8542310000 |
Ram_size | 6 KB |
Program_memory_type | Flash |
Program_memory_size | 32 Kb |
Pin_count | 32 |
Supplier_package | HVQFN |
Operating_temperature | -40 to 85 °C |
Operating_supply_voltage | 1.8 to 3.6 V |
Specifications | https://4donline.ihs.com/images/VipMasterIC/IC/PHGL/PHGLS29591/PHGLS29591-1.pdf?hkey=52A5661711E402568146F3353EA87419 |
Watchdog | 1 |
On_chip_adc | 8-chx10-bit |
Number_of_timers | 4 |
Htsn | 8542310001 |
Eccn | EAR99 |
Device_core | ARM Cortex-M0 |
Data_memory_size | 2 KB |
Data_bus_width | 32 Bit |
Country_of_origin | Taiwan |
Бренд | |
Instruction_set_architecture | RISC |
Тип интерфейса | Serial I2C, SPI, UART |
Number_of_programmable_i_os | 26 |
Max_speed | 50 MHz |
Msl_level | 1 |
Mounting | Surface Mount |
Max_processing_temp | 260 °C |
Max_power_dissipation | 1.5 W |
Lead_finish | Gold Over Nickel Palladium |
MCU 32-Bit LPC11U24 ARM Cortex-M0 RISC 32KB Flash 1.8V to 3.6V 32-Pin HVQFN Tray
Product_dimensions | 5 x 5 x 0.85 mm |
---|---|
Screening_level | Industrial |
Schedule_b | 8542310000 |
Ram_size | 6 KB |
Program_memory_type | Flash |
Program_memory_size | 32 Kb |
Pin_count | 32 |
Supplier_package | HVQFN |
Operating_temperature | -40 to 85 °C |
Operating_supply_voltage | 1.8 to 3.6 V |
Specifications | https://4donline.ihs.com/images/VipMasterIC/IC/PHGL/PHGLS29591/PHGLS29591-1.pdf?hkey=52A5661711E402568146F3353EA87419 |
Watchdog | 1 |
On_chip_adc | 8-chx10-bit |
Number_of_timers | 4 |
Htsn | 8542310001 |
Eccn | EAR99 |
Device_core | ARM Cortex-M0 |
Data_memory_size | 2 KB |
Data_bus_width | 32 Bit |
Country_of_origin | Taiwan |
Бренд | |
Instruction_set_architecture | RISC |
Тип интерфейса | Serial I2C, SPI, UART |
Number_of_programmable_i_os | 26 |
Max_speed | 50 MHz |
Msl_level | 1 |
Mounting | Surface Mount |
Max_processing_temp | 260 °C |
Max_power_dissipation | 1.5 W |
Lead_finish | Gold Over Nickel Palladium |