MCU 16-bit/32-bit LPC2000 ARM7TDMI-S RISC ROMLess 1.8V/3.3V 144-Pin LQFP Tray, LPC2210FBD144/01,5, NXP

MCU 16-bit/32-bit LPC2000 ARM7TDMI-S RISC ROMLess 1.8V/3.3V 144-Pin LQFP Tray

Program_memory_type	ROMLess
Supplier_package	LQFP
Specifications	https://4donline.ihs.com/images/VipMasterIC/IC/PHGL/PHGLS18253/PHGLS18253-1.pdf?hkey=52A5661711E402568146F3353EA87419
Screening_level	Industrial
Schedule_b	8542310000
Ram_size	16 Kb
Product_dimensions	20.1 x 20.1 x 1.45 mm
Pin_count	144
Operating_temperature	-40 to 85 °C
Operating_supply_voltage	1.8, 3.3 V
Eccn	EAR99
Htsn	8542310001
Тип интерфейса	I2C/SPI/SSP/UART
Device_core	ARM7TDMI-S
Country_of_origin	Taiwan
Бренд	NXP
On_chip_adc	8-chx10-bit
Min_operating_supply_voltage	1.65, 2.5, 3 V
Number_of_timers	2
Number_of_programmable_i_os	76
Msl_level	2
Mounting	Surface Mount
Max_speed	75 MHz
Max_processing_temp	260 °C
Max_power_dissipation	1500 mW
Max_operating_supply_voltage	1.95, 3.6 V
Lead_finish	Tin

Артикул: LPC2210FBD144/01,5

Описание

MCU 16-bit/32-bit LPC2000 ARM7TDMI-S RISC ROMLess 1.8V/3.3V 144-Pin LQFP Tray

Program_memory_type	ROMLess
Supplier_package	LQFP
Specifications	https://4donline.ihs.com/images/VipMasterIC/IC/PHGL/PHGLS18253/PHGLS18253-1.pdf?hkey=52A5661711E402568146F3353EA87419
Screening_level	Industrial
Schedule_b	8542310000
Ram_size	16 Kb
Product_dimensions	20.1 x 20.1 x 1.45 mm
Pin_count	144
Operating_temperature	-40 to 85 °C
Operating_supply_voltage	1.8, 3.3 V
Eccn	EAR99
Htsn	8542310001
Тип интерфейса	I2C/SPI/SSP/UART
Device_core	ARM7TDMI-S
Country_of_origin	Taiwan
Бренд	NXP
On_chip_adc	8-chx10-bit
Min_operating_supply_voltage	1.65, 2.5, 3 V
Number_of_timers	2
Number_of_programmable_i_os	76
Msl_level	2
Mounting	Surface Mount
Max_speed	75 MHz
Max_processing_temp	260 °C
Max_power_dissipation	1500 mW
Max_operating_supply_voltage	1.95, 3.6 V
Lead_finish	Tin