Описание
The STM32F412XE/G devices are based on the high-performance ARM® Cortex® -M4 32- bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all ARM single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. The STM32F412XE/G belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching. The STM32F412XE/G incorporate high-speed embedded memories (up to 1 Mbyte of Flash memory, 256 Kbyte of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix. All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers, two PWM timer for motor control and two general-purpose 32-bit timers.
Dynamic Efficiency Line with BAM (Batch Acquisition Mode) Core: ARM® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories Up to 1 Mbyte of Flash memory 256 Kbyte of SRAM Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory Dual mode Quad-SPI interface LCD parallel interface, 8080/6800 modes Clock, reset and supply management 1.7 V to 3.6 V application supply and I/Os POR, PDR, PVD and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Power consumption Run: 112 µA/MHz (peripheral off) Stop (Flash in Stop mode, fast wakeup time): 50 µA Typ @ 25 °C; 75 µA max @25 °C Stop (Flash in Deep power down mode, slow wakeup time): down to 18 µA @ 25 °C; 40 µA max @25 °C Standby: 2.4 µA @25 °C / 1.7 V without RTC; 12 µA @85 °C @1.7 V VBAT supply for RTC: 1 µA @25 °C 1×12-bit, 2.4 MSPS ADC: up to 16 channels 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support General-purpose DMA: 16-stream DMA Up to 17 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers(independent and window),one SysTick timer Debug mode Serial wire debug (SWD) & JTAG Cortex®-M4 Embedded Trace Macrocell™ Up to 114 I/O ports with interrupt capability Up to 109 fast I/Os up to 100 MHz Up to 114 five V-tolerant I/Os Up to 17 communication interfaces Up to 4x I2C interfaces (SMBus/PMBus) Up to 4 USARTs (2 x 12.5 Mbit/s,2 x 6.25 Mbit/s), ISO 7816 interface, LIN,IrDA, modem control) Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces SDIO interface (SD/MMC/eMMC) Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY 2x CAN (2.0B Active)
