MCU 32-Bit TC267 TriCore RISC 2.5MB Flash 1.17V to 1.43V 292-Pin LFBGA T/R, TC267D40F200NBCKXUMA1, Infineon

MCU 32-Bit TC267 TriCore RISC 2.5MB Flash 1.17V to 1.43V 292-Pin LFBGA T/R

Характеристики

Program_memory_size

2.5 MB

Number_of_programmable_i_os

169

Number_of_timers

4

On_chip_adc

50-chx12-bit

Operating_supply_voltage

1.17 to 1.43 V

Operating_temperature

-40 to 125 °C

Pin_count

292

Product_dimensions

17 x 17 x 1.37 mm

Program_memory_type

Flash

Mounting

Surface Mount

Ram_size

240 KB

Schedule_b

8542330000

Screening_level

Extended

Special_features

CAN Controller

Specifications

https://4donline.ihs.com/images/VipMasterIC/IC/INFN/INFN-S-A0003668918/INFN-S-A0003668918-1.pdf?hkey=52A5661711E402568146F3353EA87419

Supplier_package

LFBGA

Watchdog

1

Msl_level

3

Бренд

Country_of_origin

United States

Data_bus_width

32 Bit

Data_memory_size

96 KB

Device_core

TriCore

Eccn

3A991.A.2

Htsn

8542330001

Max_speed

200 MHz

Instruction_set_architecture

RISC

Тип интерфейса

CAN, Ethernet, FlexRay, LIN, QSPI, Serial I2C

Lead_finish

Gold Over Nickel

Max_power_dissipation

1090 mW

Max_processing_temp

260 °C

Артикул: TC267D40F200NBCKXUMA1

Описание

MCU 32-Bit TC267 TriCore RISC 2.5MB Flash 1.17V to 1.43V 292-Pin LFBGA T/R

Детали

Program_memory_size

2.5 MB

Number_of_programmable_i_os

169

Number_of_timers

4

On_chip_adc

50-chx12-bit

Operating_supply_voltage

1.17 to 1.43 V

Operating_temperature

-40 to 125 °C

Pin_count

292

Product_dimensions

17 x 17 x 1.37 mm

Program_memory_type

Flash

Mounting

Surface Mount

Ram_size

240 KB

Schedule_b

8542330000

Screening_level

Extended

Special_features

CAN Controller

Specifications

https://4donline.ihs.com/images/VipMasterIC/IC/INFN/INFN-S-A0003668918/INFN-S-A0003668918-1.pdf?hkey=52A5661711E402568146F3353EA87419

Supplier_package

LFBGA

Watchdog

1

Msl_level

3

Бренд

Country_of_origin

United States

Data_bus_width

32 Bit

Data_memory_size

96 KB

Device_core

TriCore

Eccn

3A991.A.2

Htsn

8542330001

Max_speed

200 MHz

Instruction_set_architecture

RISC

Тип интерфейса

CAN, Ethernet, FlexRay, LIN, QSPI, Serial I2C

Lead_finish

Gold Over Nickel

Max_power_dissipation

1090 mW

Max_processing_temp

260 °C